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MC10EP101 Quad 4-Input OR/NOR
The MC10EP101 is a Quad 4-input OR/NOR gate. The device is functionally equivalent to the E101. With AC performance faster than the E101 device, the EP101 is ideal for applications requiring the fastest AC performance available. All VCC and VEE pins must be externally connected to power supply to guarantee proper operation.
* * * * * * * * *
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250ps Typical Propagation Delay High Bandwidth to 3 Ghz Typical PECL mode: 3.0V to 5.5V VCC with VEE = 0V ECL mode: 0V VCC with VEE = -3.0V to -5.5V 75k Internal Input Pulldown Resistors ESD Protection: >4KV HBM, >100V MM Moisture Sensitivity Level 2 For Additional Information, See Application Note AND8003/D Flammability Rating: UL-94 code V-0 @ 1/8", Oxygen Index 28 to 34 Transistor Count = 173 devices
LOGIC DIAGRAM
D0a D0b D0c D0d D1a D1b D1c D1d D2a D2b D2c D2d D3a D3b D3c D3d Q1 Q1 32 1 Q0 Q0
32-LEAD TQFP FA SUFFIX CASE 873A
MARKING DIAGRAM*
MC10 EP101 AWLYYWW
A WL YY WW
= Assembly Location = Wafer Lot = Year = Work Week
*For additional information, see Application Note AND8002/D
PIN DESCRIPTION
PIN D0a-D3d Q0-Q3, Q0-Q3 VCC VBB VEE FUNCTION ECL Data Inputs ECL Data Outputs Positive Supply Reference Voltage Output Negative, 0 Supply
Q2 Q2 Dna L H X X X H
TRUTH TABLE
Dnb L X H X X H Dnc L X X H X H Dnd L X X X H H Qn L H H H H H Qn H L L L L L
Q3 Q3
ORDERING INFORMATION
Device MC10EP101FA MC10EP101FAR2 Package TQFP TQFP Shipping 250 Units/Tray 2000 Tape & Reel
(c) Semiconductor Components Industries, LLC, 1999
1
March, 2000 - Rev. 1
Publication Order Number: MC10EP101/D
MC10EP101
D0d D1a D1b D1c D1d D2a D2b D2c
24 D0c D0b D0a VEE Q0 Q0 VCC VCC 25 26 27 28
23
22
21
20
19
18
17 16 15 14 13 D2d D3a D3b VCC D3c D3d VEE NC
MC10EP101
29 30 31 32 1 2 3 4 5 6 7 8 12 11 10 9
VCC Q1
Q1
Q2
Q2
Q3
Q3 VCC
Figure 1. 32-Lead TQFP Pinout (Top View)
Warning: All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation.
MAXIMUM RATINGS*
Symbol VEE VCC VI VI Iout TA Tstg JA JC Tsol Power Supply (VCC = 0V) Power Supply (VEE = 0V) Input Voltage (VCC = 0V, VI not more negative than VEE) Input Voltage (VEE = 0V, VI not more positive than VCC) Output Current Operating Temperature Range Storage Temperature Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Solder Temperature (<2 to 3 Seconds: 245C desired) Still Air 500lfpm Continuous Surge Parameter Value -6.0 to 0 6.0 to 0 -6.0 to 0 6.0 to 0 50 100 -40 to +85 -65 to +150 80 55 12 to 17 265 Unit VDC VDC VDC VDC mA C C C/W C/W C
* Maximum Ratings are those values beyond which damage to the device may occur.
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MC10EP101
DC CHARACTERISTICS, ECL/LVECL (VCC = 0V, VEE = -5.5V to -3.0V) (Note 3.)
-40C Symbol IEE VOH VOL VIH VIL IIH Characteristic Power Supply Current (Note 1.) Output HIGH Voltage (Note 2.) Output LOW Voltage (Note 2.) Input HIGH Voltage Single Ended Input LOW Voltage Single Ended Input HIGH Current Min 45 -1135 -1995 -1210 -1935 Typ 57 -1060 -1810 Max 75 -885 -1685 -885 -1610 150 Min 45 -1070 -1995 -1145 -1870 25C Typ 58 -945 -1745 Max 75 -820 -1620 -820 -1545 150 Min 45 -1010 -1995 -1085 -1810 85C Typ 59 -885 -1685 Max 75 -760 -1560 -760 -1485 150 Unit mA mV mV mV mV A
IIL Input LOW Current -150 -150 -150 A NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained. 1. VCC = 0V, VEE = VEEmin to VEEmax, all other pins floating. 2. All loading with 50 ohms to VCC -2.0 volts. 3. Input and output parameters vary 1:1 with VCC.
DC CHARACTERISTICS, LVPECL (VCC = 3.3V 0.3V, VEE = 0V) (Note 6.)
-40C Symbol IEE VOH VOL VIH VIL IIH Characteristic Power Supply Current (Note 4.) Output HIGH Voltage (Note 5.) Output LOW Voltage (Note 5.) Input HIGH Voltage Single Ended Input LOW Voltage Single Ended Input HIGH Current Min 45 2165 1305 2090 1365 Typ 57 2240 1490 Max 75 2415 1615 2415 1690 150 Min 45 2230 1305 2155 1430 25C Typ 58 2355 1555 Max 75 2480 1680 2480 1755 150 Min 45 2290 1305 2215 1490 85C Typ 59 2415 1615 Max 75 2540 1740 2540 1815 150 Unit mA mV mV mV mV A
IIL Input LOW Current -150 -150 -150 A NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained. 4. VCC = 3.0V, VEE = 0V, all other pins floating. 5. All loading with 50 ohms to VCC -2.0 volts. 6. Input and output parameters vary 1:1 with VCC.
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MC10EP101
DC CHARACTERISTICS, PECL (VCC = 5.0V 0.5V, VEE = 0V) (Note 9.)
-40C Symbol IEE VOH VOL VIH VIL IIH Characteristic Power Supply Current (Note 7.) Output HIGH Voltage (Note 8.) Output LOW Voltage (Note 8.) Input HIGH Voltage Single Ended Input LOW Voltage Single Ended Input HIGH Current Min 45 3865 3005 3790 3065 Typ 57 3940 3190 Max 75 4115 3315 4115 3390 150 Min 45 3930 3005 3855 3130 25C Typ 58 4055 3255 Max 75 4180 3380 4180 3455 150 Min 45 3990 3005 3915 3190 85C Typ 59 4115 3315 Max 75 4240 3440 4240 3515 150 Unit mA mV mV mV mV A
IIL Input LOW Current -150 -150 -150 A NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained. 7. VCC = 5.0V, VEE = 0V, all other pins floating. 8. All loading with 50 ohms to VCC -2.0 volts. 9. Input and output parameters vary 1:1 with VCC.
AC CHARACTERISTICS (VCC = 3.0V to 5.5V; VEE = 0V) or (VCC = 0V; VEE = -3.0V to -5.5V)
-40C Symbol fmax tPLH, tPHL tSKEW tJITTER tr tf Characteristic Maximum Toggle Frequency (Note 10.) Propagation Delay Device Skew Part-to-Part (Note 11.) Cycle-to-Cycle Jitter Output Rise and Fall Times (20% - 80%) 100 Q, Q D ->Q, Q Q, Q 125 Min Typ 3.0 225 TBD TBD TBD 150 200 100 325 150 Max Min 25C Typ 3.0 250 TBD TBD TBD 170 250 120 370 170 Max Min 85C Typ 3.0 300 TBD TBD TBD 190 270 420 Max Unit GHz ps ps ps ps
10. Fmax guaranteed for functionality only. 11. Skew is measured between outputs under identical transitions.
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MC10EP101
PACKAGE DIMENSIONS
TQFP FA SUFFIX 32-LEAD PLASTIC PACKAGE CASE 873A-02 ISSUE A
A A1
32 25 4X
0.20 (0.008) AB T-U Z
1
-T- B B1
8
-U- V P DETAIL Y
17
AE
V1 AE DETAIL Y
9
-Z- 9 S1 S
4X
0.20 (0.008) AC T-U Z
G -AB-
SEATING PLANE
DETAIL AD
-AC-
BASE METAL
N
F
8X
D
M_ R
0.20 (0.008)
M
AC T-U Z
0.10 (0.004) AC
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT DATUM PLANE -AB-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -AC-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.520 (0.020). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER MAY VARY FROM DEPICTION. MILLIMETERS MIN MAX 7.000 BSC 3.500 BSC 7.000 BSC 3.500 BSC 1.400 1.600 0.300 0.450 1.350 1.450 0.300 0.400 0.800 BSC 0.050 0.150 0.090 0.200 0.500 0.700 12_ REF 0.090 0.160 0.400 BSC 1_ 5_ 0.150 0.250 9.000 BSC 4.500 BSC 9.000 BSC 4.500 BSC 0.200 REF 1.000 REF INCHES MIN MAX 0.276 BSC 0.138 BSC 0.276 BSC 0.138 BSC 0.055 0.063 0.012 0.018 0.053 0.057 0.012 0.016 0.031 BSC 0.002 0.006 0.004 0.008 0.020 0.028 12_ REF 0.004 0.006 0.016 BSC 1_ 5_ 0.006 0.010 0.354 BSC 0.177 BSC 0.354 BSC 0.177 BSC 0.008 REF 0.039 REF
J
CE
SECTION AE-AE
X DETAIL AD
GAUGE PLANE
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0.250 (0.010)
H
W
K
Q_
DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X
-T-, -U-, -Z-
EE EE EE EE
MC10EP101
Notes
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MC10EP101
Notes
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MC10EP101
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PUBLICATION ORDERING INFORMATION
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MC10EP101/D

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